Geometry and construction
Identify controlled dimensions, copper features, hole requirements and the evidence needed for the approved stackup.
GlobalWin
Process &
Process &
Capabilities
Understand how material, patterning and interconnect decisions come together—and turn your PCB design into a clearer manufacturing brief.
01
Eight process topicsMaterials through final markings
02
Connected requirementsReview the complete construction
03
Project-specific scopeConfirm capability before release
01 / Understand the requirement
A manufacturing route, not a list of isolated limits.
PCB fabrication brings together material preparation, circuit formation, layer bonding, hole formation, metallization and surface processing. A conventional multilayer route provides a useful reference, but the sequence depends on the construction.
Use this section to identify the questions that need to be settled for your board. Bring the drawing, stackup and manufacturing files together before requesting confirmation of a difficult feature. A maximum from one process should not be combined with an unrelated minimum from another as an assumed build guarantee.
03 / A quote-ready specification
Review the interfaces between processes.
The most useful manufacturing discussion connects the feature to the processes before and after it.
On a narrow screen, scroll the table horizontally.
| Requirement | What to provide | What to confirm |
|---|---|---|
| Material → lamination | Grade, compatible bonding system and finished dielectric construction. | Approve the stackup and substitution rules together. |
| Dry film → etching | Copper construction, resist role and finished pattern geometry. | Define the finished feature, not only the artwork. |
| Drilling → plating | Finished opening, board thickness, layer span and copper requirements. | Resolve hole dimensions and interconnect acceptance in one review. |
| Copper → solder mask | Pad geometry, required exposed areas and via treatment. | Check mask data against the actual copper requirements. |
| Mask → silk screen | Surface, functional keep-outs, contrast and controlled text. | Keep identification readable without contaminating exposed features. |
| Fabrication → assembly | Finished board condition, surface finish and assembly-specific restrictions. | Provide the relevant assembly requirements before fabrication release. |
This section explains general process principles. It does not publish a universal limit table or establish machine ownership, certifications, guaranteed delivery times or included test coverage. Request a project-specific capability and acceptance review.
04 / From review to release
A typical multilayer route
An illustrative route, not a mandatory traveler. The placement of finishing, marking and other stages can vary; advanced constructions may repeat selected operations.
- 01
Material & data review
Resolve the files, layer arrangement and material requirements.
- 02
Inner-layer imaging
Apply and pattern temporary resist for the selected copper route.
- 03
Inner-layer etch & inspection
Form the internal circuits and define the checks before bonding.
- 04
Lay-up & lamination
Bond the approved core, prepreg and foil construction.
- 05
Drilling & wall preparation
Form the specified openings and prepare plated features.
- 06
Metallization & outer circuits
Complete the selected copper, imaging and etching sequence.
- 07
Mask, finish & marking
Apply the specified protection, exposed-surface treatment and identification in the approved sequence.
- 08
Profile, test & release
Complete the outline and agreed dimensional, electrical and release checks.
Resolve the interfaces before release.
Use a single approved file revision and a coordinated requirement list. Identify which dimensions, materials and process changes need written approval.
05 / Define verification
Define what will demonstrate conformity.
Agree the evidence as part of the order—not after a problem appears. A test or certificate name should correspond to a specific requirement.
Connectivity and electrical targets
Separate connectivity testing from impedance or other application-specific electrical verification. Confirm the required scope for each.
Workmanship and traceability
Define relevant coating, marking and finished-board criteria. State the required records, sampling and lot / revision identification.
Request the inspection scope, sampling and supplied records required by your project. Illustrations, general references and supplier data do not establish included GlobalWin testing or a production guarantee.
06 / Common questions
Process & Capabilities FAQs
Practical answers before you finalize the data or request a quotation.
Are the figures on a material supplier’s website your production limits?
No. Supplier data describes that supplier’s material or process product. GlobalWin capability must be confirmed for the complete board construction and order requirements.
Is this the exact process sequence for every PCB?
No. The route depends on the construction, material system and selected process. Some multilayer builds use processed subassemblies and repeated operations.
Which page should I start with?
Start with PCB Materials and Lamination for an unresolved stackup; Drilling and Plating for interconnect questions; or the relevant patterning and coating topic for artwork concerns.
What belongs in the first RFQ package?
Provide fabrication data, a dimensioned outline, drill / route files, the proposed stackup, quantity and revision. Add the critical requirements and distinguish fixed decisions from open questions.
Does a quote automatically include every listed inspection?
Do not assume it does. Identify the tests, sampling and records needed, and have the scope confirmed in the quotation and accepted order.
Can I request fabrication and assembly together?
Include the assembly scope, BOM, placement data and relevant component or process restrictions with the fabrication package. Confirm the combined project scope in the quotation.
Start your project
Request a Quote Let’s review your next build.
Share your fabrication files, quantity and assembly requirements.